Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen
We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Electronics Forum | Wed Oct 23 15:00:21 EDT 2002 | Terry Burnette
Dave, we're about to publish a paper in Advanced Packaging mag. on the use of dye penetrant testing. Educate me on how to enclose the paper on this web site and I'll be glad to let everyone review it.
Electronics Forum | Wed Oct 23 15:50:31 EDT 2002 | bdoyle
Hi Terry, You can post the article in the library component on the site. If you also send it to me via email (bpdoyle@smtnet.com) I'll look it over for next month's express.
Electronics Forum | Thu Oct 24 11:19:31 EDT 2002 | nifhail
thanx Randy.. But Terry how can I get the chnace to look at the paper that you are going to publish. thank you.
Electronics Forum | Wed Jan 26 09:27:41 EST 2005 | davef
Look here for more on dye & pry: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Wed Feb 06 22:27:05 EST 2008 | davef
While you're waiting for others to reply, read a previous posting here on SMTnet http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Thu Feb 07 22:24:17 EST 2008 | davef
Here's another thread from the fine SMTnet Archives on dye penetrant http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17561
Electronics Forum | Thu Feb 07 22:57:29 EST 2008 | davef
The link to the IVF paper referenced in the link above seems to broken. Here's another link to it http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=363
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
