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New Equipment | Industrial Automation
HIMA F3414 F 3414 4 Channel Relay Module MODULE new and Original GERMANY 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicated to Global
New Equipment | Industrial Automation
HIMA F6214 F 6214 Analog Input Module MODULE new and Original GERMANY 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicated to Global Au
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New Equipment | Industrial Automation
HIMA F3332 F 3332 Output Module MODULE new and Original GERMANY 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicated to Global Auto Par
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New Equipment | Industrial Automation
HIMA F3331 F 3331 Output Module MODULE new and Original GERMANY 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicated to Global Auto Par
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New Equipment | Industrial Automation
HIMA F7102 F 7102 Insulation Monitor Module MODULE new and Original GERMANY 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicat
Industry News | 2016-07-30 19:27:59.0
Metcal today announced that it has appointed Neil Edwards as the Regional Sales Manager for the UK, including Ireland and Eastern Europe, for Metcal. Edwards will report to Rick Nuttall, Director of European Sales, OK International Ltd.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Industry News | 2012-05-02 15:13:45.0
The Northeast Shingo Prize Conference will be held at the DCU Center in Worcester MA on September 25-26, 2012. The conference focuses on how organizations striving for operational excellence need to share information in order to achieve continuous growth. Those with the greatest depth and breadth of Lean deployment experience and success have discovered passion and purpose for sharing on many levels.
