Electronics Forum: effect (Page 4 of 240)

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Mon Mar 20 16:47:13 EDT 2017 | u4bga

We're currently using no-clean flux (SR-12) in a no-clean manual soldering process. The brownish flux residue impedes direct visual inspection of the solder joints. Therefore, we're forced to clean the residue off. (1) Is there testing we can do

solder paste alloy effect on high frequency board

Electronics Forum | Wed Oct 10 12:20:44 EDT 2007 | slthomas

Does it fail to function or does it function outside of acceptable tolerances? If the latter I wouldn't know what to think, but if the former I would feel obligated to suspect solder quality or maybe even a component problem with the elevated lead-

solder paste alloy effect on high frequency board

Electronics Forum | Sun Nov 04 05:11:14 EST 2007 | omidjuve

can you send me the articles about the high frequency boards issues with different types of solder paste alloy because i can`t find any free document about this article

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Mon Dec 30 08:14:45 EST 2013 | jax

I was unaware of any Pb-Free process capable FR-1 laminate... not to mention capable of Though Hole plating that would be expected when wave soldering. What is the Td and Z-expansion for the laminate you are using?

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Wed Jan 01 21:58:31 EST 2014 | mysmt

Hi , Wish you a happy new year. Find attached datasheet of laminate. Thanks,

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Thu Jan 02 23:39:33 EST 2014 | mysmt

Hi, FR1 laminiate used is only for single side type and THD plating is not used. I have also attached laminate manufaturer's datasheet. Thanks,

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Tue Mar 21 12:52:56 EDT 2017 | emeto

No clean is giving us problem in ICT. Other than that, a coating of flux should remain there to pretect the solder joint from the environment. In general you should not clean NO clean - it is supposed to be there.

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Thu Nov 02 15:45:04 EDT 2017 | dleeper

For low volume hand assembly, deionized water or IPA should work fine.

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Fri Nov 03 15:43:20 EDT 2017 | dleeper

IPA and DI water are both very common and effective methods of cleaning PCBAs. http://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/pcba-cleaning/aqueous-cleaning.html http://blog.gotopac.com/2010/11/18/ipa-as-a-universal-cleaner

Long term effect of lead free solder on plating

Electronics Forum | Mon Feb 27 09:31:10 EST 2006 | Slaine

on sections ive looked at with 7 microns of silver and 4microns of copper, the silver had been totally absorbed into the solder in most places and a large amount in some places all the copper as well, so i think the answer is that to provide long ter


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