Electronics Forum | Wed Aug 25 15:54:46 EDT 2010 | blnorman
I previously did a search on "peel back force" > and there were a few results, and there were a > few hits that say EIA-481 is the standard, but > nothing on what the standard force range is. A > search on "cover tape" yeilds many hits about >
Electronics Forum | Thu Aug 31 16:18:30 EDT 2006 | GS
I beg you pardon AR, I made a mistake by reading your request, you are looking for a service lab who can do the peel back force test and not the Reference Standard (like EIA-481) for T&R. You should check if in your Country some Tape and Reeling Serv
Electronics Forum | Tue May 23 16:56:10 EDT 2000 | Ashok Dhawan
For grounding Table Mats/ Floor Mats and workstations, does grounding resistor need special characterstics e.g Wattage, material of construction, etc. We intend to use 1M Ohms resistor. EIA-625 does refer to EOS/ESD-S6.1 standard ( paragraph 7) fo
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
Electronics Forum | Tue Jan 23 17:48:17 EST 2007 | GS
for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Also IEC 60286-2 (leaded components like axials, radials,..) Regards......GS
Electronics Forum | Fri Jul 29 13:42:38 EDT 2016 | gregp
The standard you need is EIA-481B. It details the taping of components from 8mm tape up to 200mm tape including component orientations. 8, 12, 16 and 24mm tape has the sprocket holes only on one side so it is easy to determine the proper orientatio
Electronics Forum | Mon Jul 24 09:27:09 EDT 2006 | nodlac
I think Dave F. and Russ hit the nail on the head...components are wrong in the reel pocket from the get go. We would make a point to specify this when ordering parts. Russ also, has a good point with his number "2" item. If your machine is optomiz
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Tue Nov 20 12:21:02 EST 2001 | mparker
First, determine a standard to follow. IPC/EIA J-STD-001C "Requirements for Soldered Electrical and Electronic Assemblies" is most current for electronic assemblies. Second, by your customers spec. determine which class of the standard to apply. Use
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
