ii-Feed is based on the strengths of Europlacer's proven concept of a cart plus elements but incorporates key aspects of our individual feeder technology, merging the best of both technologies. http://www.europlacer.com/en/ii-feed.html
Technical Library | 2023-06-02 14:13:02.0
This work examines the use of dual-material fused filament fabrication for 3D printing electronic componentsand circuits with conductive thermoplastic filaments. The resistivity of traces printed fromconductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillerswas found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with valuesspanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fracturedeasily, but the copper-based filament could be bent at least 500 times with little change in its resistance.Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filamenthad an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material3D printing was used to fabricate a variety of inductors and capacitors with properties that could bepredictably tuned by modifying either the geometry of the components, or the materials used to fabricatethe components. These resistors, capacitors, and inductors were combined to create a fully 3Dprinted high-pass filter with properties comparable to its conventional counterparts. The relatively lowimpedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wirelesspower transfer. We also demonstrate the ability to embed and connect surface mounted components in3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thusdemonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composedof either embedded or fully-printed electronic components.
LIFO OR FIFO STACKER MODEL NO.:ERB-370, EMB-370
Industry News | 2002-09-18 19:30:25.0
NIKON, BOSS INTERNATIONAL, AND PATTERN WORKS EMBED SCALABLE GIVEMEPOWER CAD SOFTWARE INTO INDUSTRY-SPECIFIC SOLUTIONS FOR BUSINESS
Industry News | 2012-10-24 16:58:28.0
Europlacer, announces that it has further strengthened its solutions with the launch of a new evolution of its tape feeding solution
New Equipment | Industrial Automation
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Industry News | 2017-10-23 16:42:14.0
Data I/O Corporation announces security provisioning support for the DS28C36 and DS2476 DeepCover® secure authentication ICs from Maxim Integrated Products, Inc. (NASDAQ: MXIM) on the SentriXTM Security Provisioning Platform.
Industry News | 2008-06-12 21:49:07.0
ScanWorks� integration into Cadence Encounter Digital IC Design Flow to provide deeper view into complex, packaged chips
Industry News | 2012-04-12 05:45:03.0
Announcement is a step further in confirming StarChip’s strategic commitment to the Smart Card business by extending its product portfolio into payment and ID markets.