Industry News | 2006-05-31 11:37:21.0
ENDICOTT, NY, May 30, 2006
Industry News | 2021-05-11 15:06:26.0
New CDE-Illinois DC Link Capacitor Series Offers Low-Profile Mounting in a High-Capacitance, High-Voltage Film Capacitor
Industry News | 2021-08-05 16:18:56.0
Mallory Sonalert Tantalum Capacitors Demonstrate Resistance to Shock, High Temperature, and Vibration; Ideal for Consumer and Military Applications
Industry News | 2020-12-21 09:09:35.0
SA's Round, Oval and Box Radial General Purpose Capacitors Supply Excellent Dielectric Strength and Volumetric Efficiency at Low Cost
New Equipment | Component Counters / SMD Counters
X-Ray Component Counter – X1000 7-15 inch reels, Loose or tightly wound components scaning Support Automatic counting components on reels, belts, ESD bags and in trays Automated counting of unknown components Fast, Easy to use operator interfa
Industry News | 2021-01-17 17:36:21.0
Nano Dimension Ltd. (Nasdaq: NNDM) offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
Industry News | 2020-12-18 11:22:27.0
Vishay T55 and TR3 Series of Tantalum Capacitors Offer Developers Two Options for Integrating Capacitance Values to 1,000μF with Low ESR into System Designs
Industry News | 2010-03-24 13:02:29.0
March 2010 — atg Luther & Maelzer GmbH, in cooperation with Everett Charles Technologies, announces that it will highlight its A5-8 Head High-Speed Flying prober in parent company Everett Charles Technologies booth #1782 at the upcoming IPC/APEX conference and exhibition.
Technical Library | 2023-06-02 14:13:02.0
This work examines the use of dual-material fused filament fabrication for 3D printing electronic componentsand circuits with conductive thermoplastic filaments. The resistivity of traces printed fromconductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillerswas found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with valuesspanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fracturedeasily, but the copper-based filament could be bent at least 500 times with little change in its resistance.Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filamenthad an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material3D printing was used to fabricate a variety of inductors and capacitors with properties that could bepredictably tuned by modifying either the geometry of the components, or the materials used to fabricatethe components. These resistors, capacitors, and inductors were combined to create a fully 3Dprinted high-pass filter with properties comparable to its conventional counterparts. The relatively lowimpedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wirelesspower transfer. We also demonstrate the ability to embed and connect surface mounted components in3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thusdemonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composedof either embedded or fully-printed electronic components.
Industry News | 2020-12-29 19:43:12.0
United Chemi-Con Flat Chip Aluminum Polymer Capacitors Provide 5,000 Hours of Operation at 105°C Guaranteed