Electronics Forum: entrapped air (Page 4 of 5)

Solder Balls @ the Wave Solder Process

Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr

It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t

Solder void underneath the mosfet

Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean

Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS

Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met

Gold Contacts

Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker

You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

Re: Solder Beading Solder Balling

Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW

| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi

Re: Questions regarding rework

Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F

1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu

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