Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Mon May 01 17:12:42 EDT 2000 | Joe
I have the same equipment and the same chemicals and have had the same problem. The part of the stencil which is glued to the mesh is being destroyed by the ultra sonics in the equipment. The only solution I found is to seal the glued part of the ste
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis
Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t
Electronics Forum | Wed May 20 05:50:08 EDT 2020 | tima
Hello colleagues, Question. Who ever done 4 mil (100uM) electro conductive epoxy dispensing? is it even possible? I did 6 mil but very unstable results... Now I need 4 mil for an application.
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Thu Jun 25 10:56:48 EDT 2020 | kumarb
Hi. Contact PVA in the US. Our company has been a supplier to them for many years to date for the adapters used in their machines. This is their vertical. Hope this helps.
Electronics Forum | Thu Aug 05 10:38:49 EDT 2004 | iggyslab
Is there a specific epoxy that is most suitable for sealing a polycarbonate chamber, which will have hydrogen flowing through it at no greater than 10psi? Can any epoxy that provides a watertight seal be used for hydrogen applications? We have th
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
