Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf
We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons
Electronics Forum | Tue Jan 20 11:54:12 EST 2009 | smt_guy
Is this Corrosion? We found our boards with this issue 45 days after they were delivered to us from supplier. The board finish is HAL Leaded. But I noticed that the corrosion like issues are coming form the tiny via holes with SILVER EPOXY FILLING.
Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama
We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r
Electronics Forum | Thu Oct 14 16:38:29 EDT 2021 | SMTA-64387687
OSP is there to keep the copper from oxidizing. Once you wash the board, the copper is exposed. So, you have to either use it right away, or store it in a non-oxygen environment (vacuum/nitrogen).
Electronics Forum | Wed Dec 05 11:35:15 EST 2001 | smtspecialist
What is the best way/material to clean leads with 20% copper exposed that have been sitting in a stock room for a couple of years. My process uses NC flux 263 from AIM and I want to stay with the NO-Clean as much as possible!
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Thu Jun 01 10:48:21 EDT 2000 | Jeremy
I am having a problem with the green solder mask flaking off exposing bare copper. The mask was defective from the board manufacturer. My problem is the boards are already assembled and we are just finding the problem. Is there a standard that cover
Electronics Forum | Tue Mar 20 15:59:15 EDT 2007 | blnorman
We use preprinted labels and laser coding. For PCB we laser mark with CO2 (NdYAG for the aluminum heat spreaders). We either have an epoxy legend to burn out or we burn the solder mask to expose the copper ground plane underneath. Laser is a much
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
