Electronics Forum | Thu Aug 30 22:36:36 EDT 2001 | davef
While I don't understand why, this topic comes-up fairly often on SMTnet. [That the topic recurs indicates there truely is a problem and I'm just too doopy to understand it.] Several things: 1 Check the fine SMTnet Archives. 2 Some glue suppliers kn
Electronics Forum | Tue Nov 19 14:58:26 EST 2002 | caldon
HEy all- We are in need of components. Chips, ICs, QFPs, BGA, SOIC, and so on. Does not matter the configuration, style, package. Stick, Tape, Matrix, Tray,Bulk. Typically should be "virgin" not used. And we would like these for a low price...FREE.
Electronics Forum | Wed Sep 22 18:23:27 EDT 1999 | Deon Nungaray
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Wed Apr 19 06:56:54 EDT 2006 | QTEK Manufacturing Ltd. www.qtek.com
QTEK Manufacturing Ltd. provide a solution to the above problem, QTEK Cover Tape Extender adds an extra 380mm to cover the tape of component reels. It saves components being wasted or discard when strating a new tape through a feeder, and enables the
Electronics Forum | Tue Sep 08 10:19:27 EDT 2009 | grics
Good Morning! I need some clarification. Our company is working with a start up company on some prototypes. On the bottom of the assembly they are placing a SOT23-5 component. It is being presented to the wave so the lead banks are parallel to the
Electronics Forum | Thu Oct 28 04:52:27 EDT 1999 | Paul Gerits
Hi Jerry, normal proces would be; 1st. reflow side (top) 2nd. curring side (bottom) 3rd. insert 4th. solderwave Reason for this is that you have a better handling and no overdue stress to components in case you do bottom before top. It is also eas
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman
In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi
Electronics Forum | Tue Mar 13 18:13:41 EDT 2018 | dleeper
Placement force usually refers to the amount of force an SMT nozzle applies to a part when placing it. You want enough force to push the component onto the paste but not so much that you damage the part. Some specialized applications involve placing
Electronics Forum | Thu Feb 01 16:33:57 EST 2007 | mika
The reject rate of yours could be a number of reasons. 1. Which component types are rejected? 2. From a particular nozzle? 3. If the rejected part will be dropped on the reject belt or reject bin; it suggests that there is a problem with the componen
