Technical Library | 2018-04-27 13:23:31.0
When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.
Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
The BGA-100 Series consists of the BGA-100, BGA-200 and BGA-300 Inspection Tools. These tools allow high magnification viewing underneath BGA and other SMT packages. The compact, handheld systems are easy to carry through the factory or to differ
New Equipment | Assembly Services
K & F Electronics Website: https://circuitboards.com/ Email to send Gerber files and or BOM: info@circuitboards.com Phone: 888-722-5310 Assembler and Manufactuer of Printed Circuit Boards (PCB) K & F Electronics has the capability to produce a
X-KAR� Brand provides Rework/Repair and SMT Assembly Equipment for assembly and repair of PCB's with Surface Mount Technology Components. Rework equipment handles all standard parts plus fine pitch QFP, BGA, CSP. SMT Rework Packages include: Hot Ai
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
