Electronics Forum: failed pull test (Page 4 of 60)

Re: Gold Finger Wear

Electronics Forum | Wed Dec 20 17:33:00 EST 2000 | Travis Slaughter

I don�t have the answer for you but it would not be difficult to make a fixture to find out. Combine a counter, pneumatic cylinder, and a solenoid in such a way to do the job for you. Cylinder pushes the card into the connector, when contact is made

Pull testing

Electronics Forum | Fri Feb 19 11:53:17 EST 1999 | MikeC

Needed Info on a cheap pull taster or somebody who offers the service. Thanks Mike Cox

IPC Conference Raises New Lead-free Reliability Concerns

Electronics Forum | Fri Apr 20 07:54:25 EDT 2007 | Bob R.

I'm in the high reliability (exempt) sector and have thermal cycled hundreds of boards in the past few years. As far as which is more reliable, SnPb or SAC305, my data is similar to what the technical literature is saying, "It Depends". In low stra

solder strength

Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc

From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some

layer 2 groundplane disconnects after hand solder

Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt

BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir

Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

SN96 solderability on electrolytic tin

Electronics Forum | Thu Dec 17 03:45:47 EST 2009 | tod1967

was the wetting test conducted with SN96? Do any Pull or stress testing?

Pull Test

Electronics Forum | Wed Aug 15 12:59:26 EDT 2001 | upinder

Hi All. I am looking for a typical Pull Test Results for the adherence of 0402 / 0603 components to the pads. Thanks USingh

Axial capacitor Pull out force

Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef

There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea


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