Electronics Forum: failure mechanisms (Page 4 of 15)

Conformal Coat Common Practices

Electronics Forum | Fri Jan 12 14:05:33 EST 2024 | rygenetic

Hi @calebcSMT, It is generally recommended to avoid coating the entire body of aluminum electrolytic capacitors. These capacitors rely on the venting of gas in case of failure or overvoltage conditions, and coating the entire component could hinder

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

PCB Thermal shock

Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef

What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

BGA open joint

Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.

You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test

PCB Baking after Wash

Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55

Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D

Re: DENDRITES

Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt

| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w

PCB/PCBA deflection standard

Electronics Forum | Mon Jan 24 20:46:07 EST 2022 | emeto

Hello, we have a stiff board that goes to HLA, where some force is applied over the board to make it fit in. This force creates some deflection/bending of the PCBA and in result we see some functional failures. I wonder if there is any standard that

Repeated reflows

Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron

Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme

Re: solder voids, pin holes.

Electronics Forum | Mon Aug 09 16:37:14 EDT 1999 | John Thorup

| Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, an


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