Electronics Forum: february (Page 4 of 5)

Re: voc free flux

Electronics Forum | Mon Mar 29 09:33:37 EST 1999 | Chrys Shea

| I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | What disadvantages are there when using this flux? | Do you have any contact details with

Re: voc free flux

Electronics Forum | Tue Mar 30 08:11:27 EST 1999 | George Steele

| | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | What disadvantages are there when using this flux? | | Do you have any contact detail

Re: Forum Home Page: What do others think?

Electronics Forum | Mon Feb 08 21:28:16 EST 1999 | Dave F

| | What did you guys do to our forum? I do not want the 5 five I want a listing of all in the last 5 days min. More and more it seems that this site getting a little less user friendly! | | | | Thanks for the comments. | | Our intention is not to

Re: Solderability of fired-silver/platinum/palladium lead terminations

Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory

| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to

IPC 610 and J-STD Rev D - What's it all About?

Electronics Forum | Thu Mar 03 16:41:11 EST 2005 | davef

According to an on-line posting ... SMTA On-line Presentation Comparing Industry Standard Revisions March 9: IPC-A-610 with Regards to Lead-free Technology There have been extensive and significant changes to the industry standard IPC-A-610 with th

Micro crack for lead free wave solder

Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly

Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity

YVL88 MKII laser Verification

Electronics Forum | Fri Nov 24 19:43:37 EST 2017 | darby

Hi everyone, I've been out of it for a while after 27 years. Got made redundant in February. What can you do? I know - turn 60 and get cranky. That'll be the ticket. Anyway...... Trying to help someone out with a Yamaha YVL88MKII. I am very conversa

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef

Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat

Researching stencil cleaners

Electronics Forum | Thu Mar 29 13:06:07 EST 2001 | billschreiber

Hello again Mike, First, I apologize to the people that have been put through this exercise. However, I cannot let you continue to misrepresent my company. Your continued attempt to cloud this issue by referring solely to the U.S. EPA�s Verificati


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