Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Thu May 20 14:38:09 EDT 2010 | davef
Unfilled vias consistently produce higher quantities and larger voids than filled vias, in some cases 5 times as much. [Effect of Filling Via-in-Pad on Voiding Rates in PWB Assembly for BGA Components; C Shea, R Raut, L Piccione; ALPHA -A Cookson Ele
Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ
Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24
Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Mon Aug 18 15:09:36 EDT 2008 | pjc
Oops, I thought it was for components- not filling via holes. Yeah, getting it fab'd in would be the way to go I would think.
