Full Site - : fine pitch throw tolerance (Page 4 of 8)

BPM Microsystems Improves Flashstream Technology

Industry News | 2008-07-24 17:23:11.0

HOUSTON � July 2008 � BPM Microsystems announces that its Flashstream technology, which was first introduced in August 2007, has undergone many improvements since its original release.

BPM Microsystems, Inc.

New Low Cost Breakout Boards Accelerate PLD Design and Hardware Evaluation

Industry News | 2011-03-28 11:42:40.0

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.

Lattice Semiconductor

Smarter Than The Competition SMART Solution systematically optimizes efficient, cost saving SMT production

Industry News | 2013-08-13 12:54:43.0

The market requires highest flexibility from electronics manufacturers.

ESSEMTEC AG

stencil to pcb manufacturing tolerance

Electronics Forum | Fri Oct 31 06:55:35 EDT 2008 | andrzej

Answer on point 2 - I understand you send him gerbers of single PCB (?). In most cases you have panelized PCBs so to avoid problems with stencil first you should order PCBs and ASK your PCB supplier to send you back his gerbers of panel. There are so

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef

Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u

Re: 20 mil pitch applications

Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason

| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what

SMT fine picth connector lead oxidize-Throw out rate too high!

Electronics Forum | Wed Sep 04 22:48:13 EDT 2013 | winson16

SMT fine pitch connector having oxidation on lead and P&P machine keep rejecting the part. Is there any alternative way to reduce the part throw out rate without jeopardize the placement accuracy? Or is it possible to re-coat the connector lead or an

Lead Sweep

Electronics Forum | Thu Jan 22 12:21:54 EST 1998 | Michael Allen

Is there a standard (JEDEC or other) for "lead sweep" errors on fine pitch (eg, 0.5mm) gull wing leads? Parts from one of my suppliers has a sweep error up to 6 mils; the mechanical drawing does not address lead sweep error, nor is there a true posi

Re: Stenciling

Electronics Forum | Tue Mar 23 09:55:33 EST 1999 | Dan Hughes

| Al, | | In general, I would agree with Justin and Scott, with the exception that I don't feel a laser cut stencil is required when printing 25 and 20 or even 16 mil pitch. We make a good chem etch stencil that will print fine pitch great if you ev

Stencil Inspection

Electronics Forum | Tue Mar 22 12:27:19 EDT 2011 | swag

At times, yes. We do high volume, fine pitch on flex panels and if we need a 8 mil width aperture, it can't be 9 or 7. It has to be 8 and we have seen times where the tolerance is +/- 1 mil. Additionally, we have received stencils with abnormally


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