Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Wed Sep 07 09:55:21 EDT 2005 | Slaine
not keen on pressing myself lot of stress can lead to delam and cracked solder joints, I prefair CNC router, lot of dust but if its extracted well its very good and stress free in more ways than one
Electronics Forum | Thu Sep 18 14:32:36 EDT 2008 | jwentz
Ditto, we just went through this with a customer "fitting" our boards into a card cage. Mechanical stress/flexing.
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Tue Nov 01 10:48:24 EST 2005 | Rob
Can't say too much about the solder joints issue, but about a decade ago we did have a lot of problems with resonators being damaged by harmonics from Ultrasonic board washing & Ultrasonic welding. However this mostly manifested itself as cracking i
Electronics Forum | Fri Jan 13 13:22:34 EST 2012 | mosborne1
I would recommend that you turn toward your PCB supplier probably China and talk to them. You should always bake your boards if this occurs. If you purchase them form a trusted source you should store them in a McDry until you use them if possible. I
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Fri Dec 20 17:09:52 EST 2019 | slthomas
I agree, that is not a gullwing lead in the normal sense but that doesn't address the failure. The wetting looks fine unless there is a problem under the lead, which is hard to tell since there is an obvious fracture. That appears to be the edge o
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from