Electronics Forum | Fri Jan 10 08:52:31 EST 2003 | nifhail
We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology. In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and pro
Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Tue Jun 19 18:15:22 EDT 2001 | davef
What do you mean when you say "structure"? Taking a different tact to get at an answer to the original question, if applications such as general, BGA attach, and die attach inspection require a resolution of 10 units. What would you suggest are the
Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto
Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
Electronics Forum | Thu Sep 30 21:01:05 EDT 2010 | globalsmtservices
Hi, We deal with Siemens Siplace parts and we have some cameras on stock. Please let us know if you still need a camera and I will send you a list with some of the ones we have and prices. We may also be interested in a swap with your flip-chip came
Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy
Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip
Electronics Forum | Wed Aug 03 05:16:11 EDT 2005 | kokjianling
hi all, i want to find out the differences of the manufacturing processes between - PBGA - EBGA - CTBGA - Themally Enhanced PBGA(TEPBGA) - High Performance BGA - MCM-PBGA - Chip array - chip array (CASON) - Super FlipChip - flip Chip CSP (FCCSP) - St
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
