Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ
proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?
Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend
Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC
Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,
Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner
Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!
Electronics Forum | Thu Sep 23 11:50:54 EDT 2004 | JB
We are using a standard nozzle Once placed, the label is not flat, the ends of the label are slightly lifted on both ends. The label is .650 x .200 Have you guys run into a similar problem?
Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David
I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?
