Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani
Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Tue Oct 26 13:53:16 EDT 1999 | Dave F
William: In answer to your questions: 1 "What do I do about a gold porosity problem?" Get it fixed, before you go out of business!!! You�ve been yapping about it on the internet for three days now!!! Get a more on!!! I don�t understand your com
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
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