Electronics Forum | Sat Jan 06 05:17:16 EST 2007 | shrikant_borkar
Hi. How one Can suggest you unless your Involment in your Process? Check Following Points and also Is Reflow Temp - Profile is as Per Glue Mfg. Requirment Are Glue Dot in Sysmetricl Position? Is glue sufficient , below IC to hold ? please visit th
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Tue Nov 04 19:34:27 EST 2003 | gregoryyork
Blimey that's a problem and a half. Water Solubles will look completely different residue wise than No Cleans, pending age and solids contents No Cleans will go white powdery - watersolubles will stay oily Alternatively process reworked PCB's through
Electronics Forum | Wed Nov 28 01:07:36 EST 2007 | shy
is there any standard gap between the terminal and pad if we place the glue? SMT-4 mention as per what you understand which is using glue at SMT without solder paste and run at wave solder for the solder paste at the terminal. Glue supplier recomm
Electronics Forum | Fri Sep 11 13:57:24 EDT 1998 | Justin Medernach
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Sun Oct 09 22:07:51 EDT 2016 | geniepro
I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could yo
Electronics Forum | Thu Jun 19 10:31:28 EDT 2014 | emeto
Hi Edri, this is not a race here. Are you curing some kind of glue on your board? THe shortest profile I ever ran is for AIM solder paste - about 4 minutes total. with speed 8m/min your profile is going to be 45 seconds and I don't think this is the
Electronics Forum | Tue Sep 15 09:04:57 EDT 1998 | Chrys
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Sep 10 17:57:38 EDT 1998 | Earl Moon
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Mon Apr 22 13:05:52 EDT 2002 | davef
Try: Somar Corporation, 11-2, Ginza 4-chome, Chuo-ku Tokyo 104-8109, JAPAN http://www.horiba.co.jp/ +81 3 35422151 +81 3 35422056 Not to imply there is anything wrong with Somar's material [having never used the material], just looking at an alterna