Electronics Forum: glue stencil design guidelines (Page 4 of 18)

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice

You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper

Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra

Paste accumulation on the squeegee side with a 15mils to 5mils Step stencil

Electronics Forum | Mon Aug 12 21:54:33 EDT 2019 | davef

I've never seen successful printing with a step as deep as you seem to be saying. The keep out would have to be jigundous!!!! SMTnet Technical Library: https://smtnet.com/library/files/upload/Step-Stencils-laserjob.pdf I'd guess * Maximum step

0402's and Gluing.............

Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie

We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int

Fine Pitch Stencil Design

Electronics Forum | Thu Dec 08 03:18:51 EST 2005 | khp_armin

Please give me some guidelines on designing Stencils for Fine Pitch.

Solder Balls-No Clean Paste/ Article on Stencil Design Guideline

Electronics Forum | Fri Aug 20 10:49:37 EDT 2010 | cobar

Article to assist with Stencil Design Guidelines http://shanelo.co.za/technical_paper_about_stencil.htm

Stenciling chipbonder.....

Electronics Forum | Wed Jan 22 16:17:27 EST 2003 | slthomas

Ya know, I got that thing because I was told, once upon a time, that besides some typical low density passive bottom sided stuff, we'd eventually be building products with SOJ's and QFP240's on both sides and short of hand dispensing big tall gobs of

Re: Glue a SOT223?

Electronics Forum | Wed Dec 13 20:22:37 EST 2000 | Dave F

George We use a 0.030" dot. Here's a link for aperture sizes for adhesive printing from Alpha. http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html Here's a link for aperture sizes for adhesive printing from Heraeus. http:/

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 06:10:24 EST 2005 | tk380514

some of th IPC design guidelines have helped my factory understand the importance of stencil, (before me they used 9 year old guidelines) carzy i know, if you are interested in stencil design then listen to what everyone else has been saying however,

SMT DESIGN

Electronics Forum | Wed Jun 12 08:04:40 EDT 2002 | davef

Consider: * Searching the fine SMTnet Archives * Buying IPC-7525, Stencil Design Guidelines


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