Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Fri Apr 13 13:45:25 EDT 2001 | gsmguru
Just a guess-- Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape ? This should be easy to verify. Otherwise it sounds like things are pretty much covered.
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Tue Dec 27 10:00:19 EST 2005 | sparrow
Hello, does anybody have experience in thermosonic gold wire bonding to electroless nickel/immersion gold?? regards, Sergey
Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
Electronics Forum | Wed Nov 10 10:41:57 EST 2010 | esoderberg
subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?
Electronics Forum | Thu Nov 11 15:55:53 EST 2010 | davef
We guess the nickle has a rougher that normal finish AND the gold is at or below your specification. The nickle bumps are poking through the gold and are oxidized, preventing contact with you ATE probes. If this is correct, it would be interesting
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Mon May 06 12:20:09 EDT 2013 | davef
Gold in solder alloys can be brittle. We always used to talk about keeping gold LT 3% in order to avoid embrittlement. Some military contracts require removal of gold from soldered contacts. Adding gold to a solder alloy that you're familiar with wi
