Electronics Forum | Thu Jan 14 23:38:34 EST 1999 | Chris G.
| I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some con
Electronics Forum | Fri Dec 09 02:20:47 EST 2005 | Mike_Kennedy
Grant, I dont quite understand the implications my self yet on gold deposit using FLASH or ENIG. However the important part of the gold finish is that it is kept under 3% of the total solder joint, so normally its safe. With the FLASH process it is m
Electronics Forum | Mon Oct 31 09:35:59 EST 2005 | Slaine
Hi as this has a gold flash the nickle should be active an not require strong fluxes, i would suggest either your not getting enough heat into it (unlikely if your seeing dewetting). or that you have a plating problem the nickle has oxidised before
Electronics Forum | Thu Apr 20 05:57:55 EDT 2006 | Huub
Do you have experience with wear resistance of spring contacts on ENIG vs Flash Au? regards, Huub.
Electronics Forum | Sat Mar 25 07:10:12 EST 2006 | davef
We agree with Chris. If your gold is applied properly and is the correct thickness, you will see no difference. One nit on Chris' comments: immersion gold will plate-out [self-limit] around 8 thou, although we've heard 12 thou.
Electronics Forum | Tue Nov 28 17:23:03 EST 2006 | flipit
Flash gold usually refers to electrolytic gold with a short plating time. In other words gold plating that requires current to plate. If you have bare copper under your soldermask, the gold is probably ENIG. The only other way to have bare copper
Electronics Forum | Fri Jun 18 12:50:32 EDT 1999 | jseagle
We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have inform
Electronics Forum | Mon Jun 03 06:40:54 EDT 2002 | ianchan
Fair greetings, just a thought on flash gold plating... stubborn brat am I?! thou shalt need to know whether the selective gold plating is for solderability enhancement purpose? or any other undisclosed purpose? at least thy hast not received any i
Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr
I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
