Electronics Forum: heat and glue (Page 4 of 29)

SPC and Wave

Electronics Forum | Fri Jul 15 03:29:52 EDT 2005 | dougs

thomas, why isn't it process control, you cant just think that because you've set up your machine properly ( pot temp, wave height, pre-heat etc etc )that everything is going to be ok, there are other factors that you wont find with wave riders or

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Dye and Pry

Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef

You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer

| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea

| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor

Re: Paste-in_hole and CTE

Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan

Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

Touch-up and Inspection Process

Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj

The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i

SPC and Wave

Electronics Forum | Fri Jul 15 10:04:02 EDT 2005 | stepheniii

It depends on what you want to accomplish. I believe DB Cooper wants a better product with less wasted effort. If so then Russ and DaveF are the ones to listen to. If you want to impress managers, customers, and others, then you are doing it right.

Dye and Pry

Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean

Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b


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