Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton
Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to
Electronics Forum | Thu Sep 20 13:28:23 EDT 2001 | ohanlon
Here is how the FormFlex system conforms to component variations. The FormFlex system utilizes an oil chamber that is common to ALL the pins once the system is set. Pushing down one pin will cause the displaced oil to be shared by all the others pins
Electronics Forum | Fri May 16 13:43:29 EDT 2003 | T.Vick
Yukim, Just another thought (way off the solder paste trail that you've been on so far)....Are the parts similar in thickness? The 4796 and 4797 HSP's have a closed loop function that compensates for variations in component thickness based on fe
Electronics Forum | Mon Mar 20 03:47:16 EST 2006 | Adrian
Hi guys, Has anyone ever had experiance with a Vision Master 150 ?, we have 2 onsite and I am trying to get accurate BGA paste height measurements from this machine, but both the machines are giving me results with huge variations, like +/- 0.2 thou
Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Thu Feb 01 20:17:56 EST 2007 | daxman
I was doing a PM on our CP4-2 and decided to check the placement height of every nozzle. (we're seeing some skewed components and a lot of dropout under stn. 1) I put a dial guage under the nozzle tip at stn 7, turned placing sol on, and checked ev
Electronics Forum | Thu Jan 20 14:28:49 EST 2000 | Scott S. Snider
I ran this test back in '92 or '93 when Alpha was first pushing to change from Brookfield to Malcolm readings. The correlation between Malcolm readings to solder paste height is good. I could always look at the viscosity reading and know at least a d
Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.
I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat
Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte
Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c
