Electronics Forum | Fri Apr 24 14:34:14 EDT 1998 | Ed Holton
Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time Your help is appreciated Ed Holton Hella E
Electronics Forum | Wed Mar 16 20:12:12 EST 2005 | bkd
Does anyone knows any vendors that supplies jedec precondition tray that could stand up to 270�C peak reflow temperature.
Electronics Forum | Tue Feb 14 01:00:47 EST 2017 | soldertraining
Soldering Bath - When we need to tin high-power contacts or a lot of wires, for example, in making harnesses, a regular soldering iron is either impossible to use due to the high thermal capacitance requirement, or takes way too long to perform the t
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Thu Aug 11 12:45:42 EDT 2016 | anhsang38
Dear All I have a question for the reflow machine. I'm using Vitronics(Mr933+)reflow. The peak temperature of the (Chip, LED, SOT) component higher than (QFP,LGA) about 4 degree when i measured proflie. All of them on the same board . I don't know w
Electronics Forum | Wed Jun 12 04:02:00 EDT 2019 | liyunqiong
SMT reflow soldering temperature setting and process flow: The influence of SMT reflow process parameters on the key parameters of reflow soldering temperature curve provides reference for the setting and adjustment of reflow soldering process para
Electronics Forum | Thu Jun 08 01:52:16 EDT 2006 | ec
Hi, Is there any special temperature setting for example , bottom temp should be lower than top temp to prevent component drop. Or any information that can help to prevent component from drop off during reflow of top side.
Electronics Forum | Wed Oct 11 20:52:51 EDT 2006 | psgill
Guys, Any of you tried running different setting on the top & bottom side temperature on the reflow oven. I'm trying to address uBGA coplanarity issue using this method. Assume board are flat. Any inputs?
Electronics Forum | Thu Oct 12 08:12:51 EDT 2006 | realchunks
I have, but not for what you are trying. Different ovens and styles react differently when you try this, so you have to experiment to see how far you can go. Why do you think different temps top and bottom will solve the coplanairty issue? Is this
