Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Wed Oct 17 02:04:39 EDT 2018 | robl
SCC3 has an operating temperature of 200C, as long as it is heat cured at 100C. https://www.electrolube.com/pdf/tds/044/DCA.pdf It's also a silicone so needs to be coated & cured away from anything you value. Otherwise there are plenty of PU's and
Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea
| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Thu Jan 11 09:19:56 EST 2007 | SMTRework
I know this is not the correct forum to post chip "reworking" questions but you guys have been very helpful in the past. My question is this, when we rework BGA components most of the time the solder reflows at a normal temp and all is well. On occ
Electronics Forum | Tue Sep 02 13:35:29 EDT 2008 | evtimov
Hi, I don;t thing there is an overtemperrature sensor. Just the thermocpouple returns a higher temp(voltage) to the controller and your software goes to alarm, cooldown or what ever it does. Emil
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
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