Koh Young 3D SPI KY8080 Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg INQUIRY Koh Young 3D SPI KY8080 Specifications: • True patented 3D volume measurement • Highest accuracy and repeatability • Solder
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm INQUIR
SUPERIOR VISION 4000 � SUPERIOR SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 4000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs, t
SUPERIOR VISION 6000 � UNRIVALED SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 6000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs,
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1、The new structure design is accord with human body engineering. 2、The software supports the database control, can emote programming and the debugging, and carries on the data collection and the analysis. 3、The software support for offline program
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1、The new structure design is accord with human body engineering. 2、The software supports the database control, can emote programming and the debugging, and carries on the data collection and the analysis. 3、The software support for offline program
New Equipment | Test Equipment
3D In line Solder Paste Inspection Machine InSPIre-1200 Plus 3D SPI PCB size:1200 x550mm Dimension:850x1430x1500mm weight:850KG Product description: 3D In line Solder Paste Inspection Machine InSPIre-1200 Plus, PCB size:1200 x550mm 3D In
New Equipment | Test Equipment
3D In line Solder Paste Inspection Machine F510 3D SPI PCB size:470 x470 mm Dimension:850x1430x1500mm weight:850KG Product description: 3D In line Solder Paste Inspection Machine F510,PCB size:470 x470 mm 3D In line Solder Paste Inspectio
Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m
