Electronics Forum | Mon Aug 31 13:29:26 EDT 2020 | dwl
What exactly do you mean by component shifting? If you mean lead over hang, i.e, how far off the pad can a component lead sit and still be acceptable, IPC 610 addresses this.
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Sun Jul 14 04:39:35 EDT 2019 | alexeyzb
I have changed job and now i have some problems. Previous experience was with high volume production and not so high quality level (class 1, 2 according IPC). Now i need to produce very high quality (and very expensive) PCBAs in Low volume production
Electronics Forum | Mon Sep 17 19:06:55 EDT 2007 | davef
We have TR-460A. We do not use it very often, because of the level of experience of our troop. It is useful for companies looking to develop, structure, and organize their wave soldering process troubleshooting skills. The information in TR-460A is n
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
Electronics Forum | Wed Apr 23 13:33:31 EDT 2003 | davef
We divide our operations, repair, and office facilities into work area classifications, each with its own set of requirements and necessary control to meet the requirements of our procedure. The requirements are in the areas of: * Air Quality * Ligh
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Tue Apr 24 21:27:43 EDT 2007 | davef
IPC-A-610D, 6.2.2 Swaged Hardware � Flared Flange
Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef
it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
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