Electronics Forum | Mon Dec 04 12:25:21 EST 2000 | nightbull
I would like to know what IPC standards to order for Manufacturing and Design guidelines for BGA? Are there two? Thanks.
Electronics Forum | Mon Dec 04 12:24:59 EST 2000 | nightbull
I would like to know what IPC standards to order for Manufacturing and Design guidelines for BGA? Are there two? Thanks.
Electronics Forum | Wed Mar 02 02:37:52 EST 2022 | davef
None of the IPC standards care how boards are soldered
Electronics Forum | Fri Nov 18 07:58:59 EST 2022 | zoeluo
What are the IPC standards? They are the most widely recognized acceptability codes in the electronics industry.
Electronics Forum | Wed Jan 11 16:56:28 EST 2006 | curtb
We are an OEM buying a PC board assemblies and want to specify correct IPC standards on our bare board drawing and on our complete assembly drawing. Can someone please tell us what IPC standards we should use? Assuming that IPC is the correct standa
Electronics Forum | Tue Apr 03 13:27:58 EDT 2001 | mparker
go to http:\www.ipc.org. get the following standards: IPC-A-600F Also look at the IPC-6010 series, this may help with your design group. Finally, consider getting IPC-SM-782 and IPC-7525. These are for Surface Mount Design & Land Pattern Standards
Electronics Forum | Tue Dec 05 04:10:43 EST 2000 | PeteC
IPC-SM-782A for one. Check www.ipc.org for more.
Electronics Forum | Tue Apr 27 20:12:42 EDT 2010 | davef
Look here: http://www.ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf ... that would get you to IPC-2252 - Design Guide for RF/Microwave Circuit Boards. Admittedly, it's not a standard, but that's what you get.
Electronics Forum | Mon Jun 14 14:39:12 EDT 2004 | davef
HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is m
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
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