Electronics Forum: j-std 001 (Page 4 of 27)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

solder SnPb wire to gold plated IC

Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef

Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,

Deionized Water Standards

Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum

Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a

IPC J-STD-001E Ionic Cleanliness Standard

Electronics Forum | Fri Aug 30 22:51:14 EDT 2013 | cvogel

IPC-J-STD-001E in regards to Ionic Cleanliness standards states less than 1.56 µg/cm² of total NaCL. Assuming a typical electronic process which involves smt, wave, and post-hand soldering and uses NO-Clean flux throughout all process, is it typi

Re: No-Clean Solder Paste

Electronics Forum | Sun Apr 05 19:02:34 EDT 1998 | Graham Naisbitt

Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. | Question: Whatparameters are used to determine "good" Solder Paste? What reference doc

Re: Solder Class 1,2,3

Electronics Forum | Thu Oct 05 09:01:19 EDT 2000 | LarryK

The IPC-A-610 has the Acceptability requirements and the ANSI/J-STD-001 has the Requirements for soldering. Both deal with the requirements for the individual classes. Both of them are published by IPC and can be purchased in lots of places includ

Re: Qualifying products in process?

Electronics Forum | Wed Sep 13 20:44:26 EDT 2000 | Dave F

Good question * Rich lathrop at Heraeus wrote a good paper on quantifying the printability of adhesives. You can probably find it on their site. * J-STD-001 is the baseliine for qualifying processes. Good luck

Re: Reflow Oven

Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F

Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.

SMT Rework

Electronics Forum | Mon May 21 10:22:29 EDT 2001 | larryk

Sean, Are you sure that you don't mean IPC instead of ISO? If so, the the IPC-A-610 is what you are looking for. If you are doing soldering rework, then look at the ANSI/J-STD-001 too. Larry

Re: Humidity Of Assembly Area

Electronics Forum | Thu Nov 04 15:28:53 EST 1999 | Dave F

Whoa Scott, them's serious numbers!!! ;-) But then again, it depends on what you're doing doesn't it? Chris: Try ANSI-J-STD-001, which says 18-30�C, 30-70%RH Good luck Dave F


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