Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Mon Dec 17 19:01:45 EST 2007 | bbarton
As someone with a LOT of experience with the "low cost" alternative alloys, primarily SACX, I have one simple question....Are these shorts a new phenomena? WAS your process in control, and all of a sudden it's not? If the answer is YES, take a look a
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Fri Dec 06 18:13:15 EST 2002 | slthomas
We only have solder balling problems in the interface of the pcb with the selective soldering pallet. All other boards (single, and double sided glue and waved alike) are fine, so I'm not thinking this is going to follow the normal path for resoluti
Electronics Forum | Fri Jan 29 11:23:54 EST 2010 | ppwlee
Smtnet, I am looking at pros and cons for automated soldering. The application is a simple multi pin through-hole soldering on a high volume manual assembly line. The goal was to eliminate defects associated with missing solder pins which goes undet
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
