Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
Electronics Forum | Tue Oct 22 20:38:50 EDT 2002 | davef
Search the fine SMTmet Archives for background on immersion silver.
Electronics Forum | Wed Jul 09 15:09:36 EDT 2003 | davef
Matt: What are we looking at in pix F2?
Electronics Forum | Wed Jul 09 16:05:46 EDT 2003 | davef
Sorry Matt. I mean the last row, second picture in from the left.
Electronics Forum | Mon Aug 08 22:51:39 EDT 2005 | plcc
Hi Davef, The whole laminate turns yellowish.
Electronics Forum | Thu May 25 08:00:49 EDT 2006 | davef
The warmest spot you measure on the board is the bare laminate. It will be 10*C hotter than a solder connection.
Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110
I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with
Electronics Forum | Tue Sep 18 07:52:29 EDT 2007 | davef
Does the change from supplier to supplier as a result of: * Board definition? * Differences in processing at fabs? 3 Specification Fir Tree General Technical Specification 3a Design/Layout: * IPC-2221 * IPC-2222 3b PCB Fab: * IPC-6011 * IPC-6012 * I
Electronics Forum | Thu Jan 31 18:14:40 EST 2008 | boardhouse
Hi Felix, First thing to verify is that your supplier is actually suppling you with the correct material. China is known for not keeping with the requested materials and will substitute if not controlled. I would recomend ITEQ, TUC or Nan ya for of
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