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2 Component PU Resin Dosing Machine 2 Component Potting and Encapsulation Meter Mix Dispenser Mixing Machine Ab Part Resin Dosing Machine

2 Component PU Resin Dosing Machine 2 Component Potting and Encapsulation Meter Mix Dispenser Mixing Machine Ab Part Resin Dosing Machine

New Equipment | Dispensing

2 Component PU Resin Dosing Machine 2 Component Potting and Encapsulation Meter Mix Dispenser Mixing Machine Ab Part Resin Dosing Machine Whatsapp+86 13425164065 Product Description Why Choose us ! semi-automatic dispensing system manual 2 compone

Guangzhou Daheng Automation Equipment Co.,LTD

United Adhesives, Inc.

Industry Directory | Manufacturer

United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Nepes Corporation

Industry Directory | Manufacturer

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.

Encore Electronic Engineering Ltd.

Industry Directory | Consultant / Service Provider / Distributor

Encore is an integrated electronic company that believes in making things better by electronic-engineering capabilities & bringing automation to our daily lives.

PVA Solidifies Optical Bonding Expertise with New Patent

Industry News | 2023-04-03 13:50:11.0

PVA is pleased to announce that it has been awarded a new patent for optical bonding. The patent is an addition to PVA's original bonding patent, "Machine for Optical Bonding, System and Method of Use Thereof."

Precision Valve & Automation (PVA)


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