Electronics Forum | Thu Oct 05 15:21:03 EDT 2006 | RusH
We are having significant issues with lead free parts on leaded assemblies. Particularly grainy and non-wetted solder joints. Does anyone have any solutions.
Electronics Forum | Fri Jan 12 12:35:58 EST 2007 | realchunks
Several things to check. Are you reflowing towards higher temps for the no-lead parts? If so are you using a 63/37 paste? If so you are buring your flux off too early. Get a solder paste designed for lead free parts on a leaded baord. There are
Electronics Forum | Sat Jan 15 23:58:24 EST 2005 | Chua
Could you advise what is the min and max peak temperature for this process. Presently, my leaded peak temperature at the range of 215 - 225 deg.C And how do I know that the solderability is at optimal. Appreciate your help......
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Mon Jan 17 11:23:49 EST 2005 | Brad
Ya Russ is right for Ti Parts they tend to use more pelladium, which requires a bit more heat average temp increase is about 10 degrees C. from 225-235. As far as optimum solder joint I look for fillets on all sides of leads. The back of the lead is
Electronics Forum | Fri Aug 12 13:17:00 EDT 2005 | patrickbruneel
To all smt neters, In many different threads I have tried to bring awareness of the dangers lead free alloys pose to the reliability of solder connections. Many times those warnings have been waved by unscientific reports (from lead free solder manu
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Fri Feb 22 15:16:24 EST 2002 | rkevin
Bet your using tin/ lead plated components with a lead free Cu/Ag/Sn alloy. It leads to intermetallic cracking. Wow didn't anyone tell you to check the archives yet, It seems to be the answer given to everyone. Why have an interactive site if you alw
Electronics Forum | Wed Jan 28 21:47:56 EST 2009 | padawanlinuxero
Hello! I am having trouble with the new changes from lead joint to lead free joint, we are working on change to lead free, I am using a 3 zone oven reflow, the zone temps are : zone 1 zone 2 zone 3 (top and bottom) 128 208 260 th
