Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Thu May 01 13:58:31 EDT 2008 | mmjm_1099
In our house we have had some of our BGA's reballed because it was a lead-free part and wanted to place on a leaded assembly. Hope this helps.
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Thu May 01 21:17:38 EDT 2008 | davef
The concern about lead contamination of lead-free solder has to with zone refining. For more, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30315
Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Mon Sep 12 10:58:03 EDT 2011 | 4kevinl
What kind of equipments you were using to detect lead? Has any existing regulation to setup the limit of lead content to determine the lead free process?
Electronics Forum | Wed Jul 14 00:50:34 EDT 2004 | Grant Petty
Hi, What's the best process for going lead free? Ordering lead free parts and using them with current paste, and then once all the parts are lead free, moving to lead free paste as well? Then the wave will be fun to change over. What a nightmare th
Electronics Forum | Wed Feb 01 07:32:05 EST 2006 | Chunks
Try an intermediate paste like Loctite/Henkle 218. It's design is to be used in a mixed lead/lead-free process.
Electronics Forum | Thu May 01 14:25:31 EDT 2008 | ck_the_flip
Most white papers, like this one http://members.ipc.org/ipclogin/ipcmembers/IPC/Route/0706/0706techpaper.pdf, have written that lead contamination in a lead-free solder joint leads to all sorts of reliability problems. Consensus is that, if the cont
Electronics Forum | Tue Jul 13 07:22:43 EDT 2004 | Kris
Hi Imtiaz, Can you give a brakup of the 23 components and their end mettalurgy ? Chip ?? QFP/TSOP ?? BGA ?? Aluminium Caps ?? this will determine whether you can do it or not
