Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Fri Apr 17 14:37:13 EDT 1998 | Justin Medernach
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, Try
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Mon Dec 06 12:27:01 EST 2004 | Scott B
We are currently reviewing a design which has a leadless chip scale package with a solder thermal pad on the underside. The application notes for the device specify use of a no-clean solder paste as the gap under the device will prevent cleaning. Is
Electronics Forum | Fri Feb 25 10:46:50 EST 2005 | John S
We are developing a new product, and some of the designers are proposing QFN packages. These look like leadless QFP's. We don't currently use anything like this, but we operate in a high reliability automotive market. Can anyone provide advice/com
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Sat Mar 03 13:36:40 EST 2007 | grantp
Hi, We are looking for a new SMT report system, you know the ones that let you align and easily solder BGA's and the newer lead-less packages that are small and have leads under the package. We have looked at a few, and some use the removal time t
Electronics Forum | Tue Apr 03 08:53:07 EDT 2007 | namruht
Thanks for the help everyone. I think that the pattern instead of a leaded component is going to have the best results. Also I checked on the software update and there is not any component database differences between the newest and my current versio
Electronics Forum | Fri Nov 30 16:41:18 EST 2007 | stevek
Does anyone have any experience with the Amkor Fusion Quad package? I'm wondering about the coverage of the heatsink slug and it floating the interior leadless terminations apart. Any designers have any experience escape routing the underpart/inter
