Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Used SMT Equipment | Soldering - Selective
Very nice Ersa Selective Solder Machine For Sale - Well maintained on SMT Production Floor See attached pictures and information Ersa Model Number: Versaflow 3/45 Serial Number: S011A-11E0088 Year: 05/2011 Software Version: Ersasoft 4.050 Wi
Technical Library | 2019-08-19 09:46:13.0
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.
Technical Library | 2019-05-21 17:31:39.0
In the field of electronics manufacturing, the end use of the product will always dictate the processes, procedures, and methods, not only for building the product, but also for testing, cleaning, and protecting the assembly in order to assure the level of quality required for proper operation. The need to protect an electronic assembly from its end use environment may stem from anyone of a number of hazardous (or potentially hazardous) conditions. Choosing the type of protective material is dependent upon matching that material’s characteristics with the conditions to be overcome. Naturally, the use of a protective (conformal) coating will require some method of verification to ensure the desired level and type of protection is achieved.
Used SMT Equipment | In-Circuit Testers
Fealures • Modular upgrade options from MDA to ICT and functional test • High fault coverage test solution • Limited access solution and functional test expansion using PXI modules • Friendly UI with fast and easy program development Tester Sp
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE Juki Spare Parts JUKI FX-1 FX-1R YA PULLEY UNIT R 40025298 Specifications: Brand Name JUKI YA PULLEY Part number 40025298 Model Ensure Test in machine confirmation Guarantee 1 month usage for machine JUKI FX-1 FX-1R
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA SMT Spare Parts Original Ys Belt Kke-M9128-000 Model NO.: KKE-M9128-000 Type: High-speed Chip Mounter Part No: Kke-M9128-000 Quality: 100% Tested Lead Time: 3 Days Trademark: YAMAHA Transport Package: Carton or as Your Requirements Specifica
Industry News | 2019-07-16 19:36:51.0
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.
