Used SMT Equipment | Pick and Place/Feeders
parameter: 1. Mounting head: 3 2. Alignment method: linear laser, video system (fixed camera) 3. Substrate size: Min:50*50*0.5(mm)-Max:460*400*4.0(mm), adjustable: 0.28-4.2t 4. Mounting speed: CHIP/ 0.22 seconds/CH
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Used SMT Equipment | AOI / Automated Optical Inspection
Operating System: Linux Details: • Inspection envelope 20” x 20” • Large format 5mp Color camera for01005 Inspection • Quad Color lighting • Telecentric, Look Down Optics • High speed precision stage with .05um Linear Encoder • System softwar
Used SMT Equipment | Depanelizers / Routers
• Under board high speed routing unit • Linear mother driven X (2x)Y axes, servo motor driven Z-axis • PCB Board Stopper mounted on routing unit • Tool rack for interchangeable gripper fingers • Camera Assisted Teaching System (CATS) • Offline P
Used SMT Equipment | Pick and Place/Feeders
The JUKI high-speed placement machine FX-1R is compatible with the linear motor used in high-speed placement and the unique HI-Drive mechanism. It inherits the traditional concept of a modular placement machine and realizes a high-speed placement m
Used SMT Equipment | Conveyors
Conveyor Technologies MFIFO .6m-21-4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass through Each Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer 21 Vertical Buf
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | Pick and Place/Feeders
Machine ame CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn C
Used SMT Equipment | Pick and Place/Feeders
Machine ame CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn C
