Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Fri Aug 18 14:00:27 EDT 2006 | slthomas
Chunks is a pretty with-it dude. The only additional thought I have is the possibility of poor misprint cleaning. If they're wiping instead of spray or US washing they may be contaminating the boards prior to reprinting. And yes, I know Chunks is
Electronics Forum | Thu Jul 19 22:12:52 EDT 2001 | davef
We don't use the connector that is giving you soldering problems. Regardless, no one here is taking bets that you'll get pay-back from increasing the length of the locking pin. If it makes you feel any better, we'd bet against a 4-40 flat head and
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
Electronics Forum | Wed Nov 06 16:31:59 EST 2002 | slthomas
I would also consider paste control (don't take it personally...I always have to get after people about this one), time on the stencil, time between print and reflow, solderability of the component leads, paste volume (that one really got us once....
Electronics Forum | Tue May 30 21:14:31 EDT 2000 | Dave F
Sal: JAX makes good points, but I�d like to think about this differently. It sounds like the poorly soldered connection is lifting the whole connector, so that termination floats on top of the solder, rather than submit to the wetting force and be
Electronics Forum | Mon Apr 19 10:52:05 EDT 2010 | esca
Hi, if you want to verify the gold contamination, is mandatory to use the XPS and FTIR analysis, but is difficult think about a gold contamination from 3 different manufacturers. Do you have cleaned the PCBs after an erroneous screen process ? If no
Electronics Forum | Wed Oct 03 09:56:51 EDT 2001 | Claude Tremblay
Hello everyone We have a QFP-308 (0.20" pitch)on a board and we have a lot of opens after reflow. We checked our profil by installing thermocouples on the pads of the component and everythings seems OK. We checked the coplanarity of the leads and it
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
