Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Fri Jan 30 06:14:01 EST 2015 | philc
And there is always the argument of "get in and out quick", which is possible with high tip temps. I prefer to use a really hot iron, and do it quickly, rather than a lower temps and keep the tipi on the bit till it melts the solder. If you have a P
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Tue Dec 10 20:42:43 EST 2002 | davef
Vijay, Sounds like you're not spending enough time at liquidous plus 20*C. And you need to stay there for 5 to 10 seconds. I know, I know. We have used bucketsful of WS609 over the years. See, as you say, the melting point of your solder alloy
Electronics Forum | Tue Jan 13 20:52:21 EST 2004 | davef
Bismuth Solder alloys * Fatigue life is reduced when soldered to hot air solder leveled (HASL) boards. * Lead from Hot Air Leveling (HAL) coatings can diffuse through the grain boundaries of alloy. * Lead is bismuth alloys can form a eutectic composi
Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Tue Dec 13 15:00:31 EST 2011 | davef
Contaminating lead-free solder connections with lead is generally a bad idea, but that's not what you plan. You plan to add tin to your tin-lead solder connection. We don't think there is a significant problem for most applications. Adding tin will
Electronics Forum | Thu Jul 10 13:02:18 EDT 2014 | clydestrum
I'm not sure what happened to my post, but we think to have got the situation under control. The solder joints on the boards looked terrible. I can only describe it as unburnt flux, maybe. (like if you took a spoonful of solder and sprayed flux direc