Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Mon May 23 11:37:36 EDT 2005 | dougt
AND A B C -------- 0 0 0 1 0 0 0 1 0 1 1 1 C is the result Are you studying for a test?
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Wed Jul 24 09:54:49 EDT 2019 | amitthepcbguy
Typically, the reliability of PCBs suffers significantly due to the increase in aspect ratio. It is not preferred to opt for high thickness boards. However, I would like to point out that your assumption seems to be wrong as board layers do not direc
Electronics Forum | Sat Nov 13 03:10:36 EST 2021 | pti88
why poor contact between PCBA board and probe？ When I used ICT to test PCBA board, there was poor contact between board and probe .
Electronics Forum | Tue Jun 20 10:46:08 EDT 2023 | dontfeedphils
Usually best to stick with older/tested OS for machines/software compatibility. Or setup a VM with Win7 or Win10 in your main machine to handle picky software suites.
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Thu Mar 06 11:37:17 EST 2003 | msivigny
Hello Phil, sorry for the confusion, because of our level of defect control and tracking at each process step, we did not use AOI systems at the time. We had a manual inspection station after reflow, then ICT and Functional/Final test for each produc
Electronics Forum | Tue Jun 19 21:44:20 EDT 2007 | rfrog
The first thing that I would do is contact the smock manufacturer and ask them for advice on testing the smocks. ESD FROM A TO Z 2nd ed. (Kolyer) states that: smocks should have a resistivity of less than 10^12/sq and must not shed steel fibers.
