Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
Electronics Forum | Mon Nov 22 11:19:39 EST 2004 | davef
Short answer: Yes. Depending on the application of the conductive ink, suppliers select different mesh for the silver particles. So, you should follow your supplier's recommendations for printing, for instance: Conductive Ink||PI-2000 Highly Condu
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Wed Sep 01 12:07:31 EDT 2010 | davef
Printing solder paste * Use single stroke, on-contact print cycle * Ensure the substrate is well supported, especially under areas of fine pitch print. * Select pressures of about 1- 2 lbs per linear inch of squeegee blade [Set squeegee pressure hig
Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea
| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra
Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon
CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module
Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon
| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ
Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El