Electronics Forum | Thu Apr 29 10:11:41 EDT 1999 | Cunli
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. | Dan, I have seen boards with 3 mil pitch (that is 1.5 mil trace and 1.5 mil spacing) in quantity
Electronics Forum | Thu Sep 06 01:12:43 EDT 2001 | Dreamsniper
Hi, What's the maximum track width that is allowed to be attached to a 0805 component land pattern. I have a 70 mil x 45 mil Land for my 0805 and is attached to a 50 mil wide track with a length of 300 mil to 1500 mil. Components affected are mostly
Electronics Forum | Mon Jan 14 18:19:35 EST 2008 | geb
Thanks for the info. I use the machine with a 1mil for resistors and capacitors and the machine with the 2.6mil for ICs (both have a 4mil.) This is because the r's & c's seem to benefit from the 1mil, more than IC's. I was thinking of making the mach
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto
Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints
Electronics Forum | Fri Sep 17 03:46:31 EDT 1999 | Charles Stringer
| | I am not familiar with the "mil" metric. How many inches is in 1 mil? | | | | ...or 10 mil? | | | | | each mil = .001" | | Earl Moon | At risk of informing someones grandmother on the art of removing the contents of an egg without breaking
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea
That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
Electronics Forum | Fri Jul 07 12:44:49 EDT 2017 | tsauve
The problem is registration between the stencil & the smallest pads on the 5 substrates. Using SPI s/w I can overlay the paste layer over the PCB image to determine stretch/shrink. Our worst case was shrinkage of 10.2mil on a 5-up 300mm panel - small
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