Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Mon Sep 27 04:08:25 EDT 1999 | Earl Moon
| | | I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than
Electronics Forum | Wed Sep 22 20:57:46 EDT 1999 | JAX
| | Question for you SMT guru's out there. | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: |
Electronics Forum | Sat Sep 25 09:18:40 EDT 1999 | Steve E ( Fuji America )
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen
Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are
Electronics Forum | Thu Mar 18 20:08:34 EST 1999 | Steve Gregory
Are you suggesting there may be some chemical incompatibility between paste/flux chemistries and the glue being used - thus intefering with the glue's ability to bond properly? I've only heard of this possibility, but never experienced it. Justin, St
Electronics Forum | Thu Sep 23 06:10:52 EDT 1999 | Wolfgang Busko
| | | Question for you SMT guru's out there. | | | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following meth
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
