Electronics Forum: mount devices (Page 4 of 24)

Storage Life for plastic SMT

Electronics Forum | Thu Jan 16 13:41:27 EST 2003 | Adrian

Is there documentation showing shelf life for plastic surface mount devices ? This will of course take into consideration that all the nessecary ESD precautions with N2 dry boxes are in use.

Lead Free soldering profile for SMT

Electronics Forum | Sat Jun 07 00:21:50 EDT 2003 | kevyeoh

J-STD-020 Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices. There's a profile for Lead Free and another for normal Sn/Pb.

SMT Part Number Standards

Electronics Forum | Thu Dec 09 17:34:27 EST 2004 | Charles Brown

I'm looking for an industry standard for naming of surface mounted devices. What does the everyone use? ex. IPC-SM-1206-06 Is this and acceptable convention?

removing glued chips

Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo

We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.

removing glues chips

Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci

We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 13 02:31:16 EDT 2006 | raqi16

Thank you! sorry, i just realized my posted question was not very specific.. no, it's not a BGA part, it's just a standard surface mount device and the only leaded part are the leads.

problem in solderability

Electronics Forum | Fri Aug 29 07:56:56 EDT 2008 | davef

Omid It depends. Follow the guidelines of ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices. It's available on-line.

Baking BGA on reel

Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef

IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]

MID ( Molded Interconnect Device ) Mount

Electronics Forum | Sun Nov 24 22:09:13 EST 2019 | fadzril

Does anyone have experience of mounting MID ( molded interconnect device )? What items are required to be prepared? Can I use my current printer, mounter or reflow ovens?

Surface Mount Component Glues

Electronics Forum | Mon Oct 16 11:53:35 EDT 2000 | Howard C. Ohlhous

I would like to know what type of glue is used to hold down surface mount devices to boards before/during solder reflow. I would like to obtain said glue for evaluation and possible use in an assembly procedure. Please Advise: What company manufactur


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