Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Mon May 09 09:23:45 EDT 2016 | markhoch
I agree with the previous two replies. This is a perfect design....if you're trying to create a graveyard full of tombstones.
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Fri Oct 29 10:02:28 EDT 1999 | John Thorup
Chris A lot of people have reported sudden, fab lot related problems with Ni/Au pads. These are usually characterized by a discoloration of the gold and called cheerful names like "black pad disease". This can be a process problem at your fab house
Electronics Forum | Thu Nov 30 16:14:33 EST 2006 | darby
Maybe ask your customer where they got this idea from? It is possible they may have even got this idea from some white paper or article where they are trying to explain something else and show drawings with no solder between the pad and lead. It may
Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders
Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.
Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS
Have you seen IPC-A-610 D ? regards GS
Electronics Forum | Tue Nov 28 15:41:51 EST 2006 | realchunks
Try IPC-SM-782.
Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef
We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a
