Electronics Forum | Mon Feb 12 16:10:19 EST 2001 | gsmguru
You could also try Benchmark in Campinas or SCI in Hortolandia.
Electronics Forum | Thu Jun 22 11:17:47 EDT 2000 | Mike
Can companies afford to place additional environmental constraints on the manufacturing process?
Electronics Forum | Mon May 14 09:39:55 EDT 2001 | martys
What role will AOI play in the future in PCB Assembly?
Electronics Forum | Mon Oct 18 05:31:38 EDT 1999 | Mattias
Does anyone have any experience of popcorning BGA�s in wavesoldering?
Electronics Forum | Tue Mar 24 09:26:56 EST 1998 | Jim Kittel
Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?
Electronics Forum | Sat Dec 20 14:06:58 EST 1997 | Vincenzo Longobardo
what is your experience about the presence of the voids in the joints ? Are they dangerous and when ?
Electronics Forum | Thu Jun 27 06:42:05 EDT 2002 | robbied
Thanks for the good info. Dave.
Electronics Forum | Tue Sep 17 08:26:28 EDT 2002 | davef
Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98
Electronics Forum | Mon Nov 11 10:57:03 EST 2002 | davef
Search the fine SMTnet Archives for background on voiding in BGA
Electronics Forum | Tue Nov 19 11:16:27 EST 2002 | sergiovito
I am interested in this mission to China? How can I participate? How is your mail address?