Electronics Forum: orange peel effect (Page 4 of 6)

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian

| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab

Re: Hot Air Nife

Electronics Forum | Thu Apr 29 10:02:07 EDT 1999 | Chrys Shea

| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A | | Tony, The hot knif

Re: Gold Finger Cleaning

Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon

| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave

BULK FEEDING

Electronics Forum | Sun Jun 21 18:06:45 EDT 1998 | Fred Dub

New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for whom the tape feeding for a long time was the solution. The rapid growth in the number of passive component

Re: BULK FEEDING

Electronics Forum | Fri Jul 10 00:04:44 EDT 1998 | Fred Dub

| New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for | whom the tape feeding for a long time was the solution. The rapid growth in the number of passive compo

bulbous joint

Electronics Forum | Fri Feb 20 12:55:43 EST 2004 | russ

Ah, the old contour wave. I don't really know how to adjust those to get correct backflow to reduce your solder volume. I need to ask why you are worried about this. Do you have a QC requirement in excess of IPC class3 wich allows for this joint t

Re: Avoiding Blood letting on stencil printer

Electronics Forum | Wed Oct 14 08:27:26 EDT 1998 | Earl Moon

| | | | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will i

Re: Avoiding Blood letting on stencil printer

Electronics Forum | Wed Oct 14 15:33:48 EDT 1998 | Justin Medernach

| | | | | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will

Re: Avoiding Blood letting on stencil printer

Electronics Forum | Wed Oct 14 17:05:14 EDT 1998 | Earl Moon

| | | | | | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This wi

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW

| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost


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